POL RIBES-PLEGUEZUELO,1,2，*SITE ZHANG,2ERIK BECKERT,1 RAMONA EBERHARDT,1FRANK WYROWSKI,2AND ANDREAS TÜNNERMANN1,2
1 Fraunhofer Institute for Applied Optics and Precision Engineering IOF, Albert-Einstein-Str. 7, 07745 Jena, Germany
2 Institute of Applied Physics, Abbe Center of Photonics, Friedrich Schiller University Jena, Max-Wien-Platz 1, 07743 Jena, Germany *pol.ribes@iof.fraunhofer.de
摘要
提出了一种用来仿真激光晶体封装技术中的诱导应力的方法，并对激光腔内部的双折射效应进行研究。这种方法已经由软件ANSYS 17.0通过热机械仿真来实现。ANSYS的结果稍后被导入到VirtualLab Fusion软件中，这款软件按照波长及偏振性对输入输出光束进行分析。研究是建立在一种用于玻璃或晶体光学封装中低应力焊接技术，也被称作焊机泵浦技术的背景下。分析结果表明对于由钇铝石榴石活性激光晶体构建的激光腔，二次谐波发生器β-钡硼酸盐，以及由低应力焊机泵浦技术组装的熔融石英的输出激光镜来说，输入及输出激光光束几乎没有差异。
○c2017 Optical Society of America OCIS codes: (140.0140) Lasers and laser optics; (220.0220) Optical design and fabrication; (260.1440) Birefringence.
参考及链接
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1. 简介
现今，激光设备广泛分布在不同的市场领域。现有的不同激光市场应用已经将对激光设备的要求推向了紧凑型、高效率和高可靠性的高度严格要求，以便能够在不同的设备条件下有效执行。此外，在汽车市场或太空应用领域中对激光设备的使用，一直在挑战激光制造商来获得在极端情况下也能够使用的更可靠紧凑的激光设备[1]。在获得具有高可靠性和高效率的微型化装置的情况下，最好的选择仍然是由胶粘剂组装成的二极管泵浦固体激光器(DPSSL)。然而，设备需要高的运行和存储温度范围，自由释气或真空兼容性，更高的热导率和电导率，甚至抗辐射组件，都导致需要寻找新的连接技术。目前有几种低压焊接技术可以用于此类设备[2]。然而，为了不损害器件的小型化，同时提供无应力的激光束谐振腔，我们必须研究封装诱导应力和随之而来的激光元件双折射现象。在本刊物中，我们研究了低应力封装激光焊接泵浦技术所产生的激光晶体的应力封装效应，此外，该方法也适用于其他激光设备的封装技术。
所谓焊机泵浦技术(图1)使用由各种软焊料合金(如锡基无铅焊料、低熔点合金或高熔点共熔合金金-锡，金-硅或金-锗焊料) 制成的直径范围为40至760μm的球形焊料预成型件。为了能够通过焊接技术将玻璃或晶体连接到金属或陶瓷基板上，这就要求将可附着的金属层涂覆到光学元件上，可通过物理汽相沉积(PVD)实现[3]。
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